A. Kosuge, J. Hashiba, T. Kawajiri, S. Hasegawa, T. Shidei, H. Ishikuro, T. Kuroda, and K. Takeuchi, “Inductively-Powered Wireless Solid-State Drive (SSD) System with Merged Error Correction of High-Speed Non-Contact Data Links and NAND Flash Memory,” IEEE Symposium on VLSI Circuits (VLSI’15), Dig. Tech. Papers, pp. C128-C129, June 2015.
A. Kosuge, S. Ishizuka, M. Abe, S. Ichikawa and T. Kuroda, “A 6.5Gb/s Shared Bus using Electromagnetic Connectors for Downsizing and Lightening Satellite Processor System by 60%,” IEEE International Solid-State Circuits Conference (ISSCC’15), Dig. Tech. Papers, pp. 434-435, Feb. 2015.
A. Kosuge, S. Ishizuka, J. Kadomoto, and T. Kuroda, “A 6Gb/s 6pJ/b 5mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and EMC-Qualified Pulse Transceiver,” IEEE International Solid-State Circuits Conference (ISSCC’15), Dig. Tech. Papers, pp. 176-177, Feb. 2015.
L. Hsu, Y. Take, A. Kosuge, S. Hasegawa, J. Kadomoto, and T. Kuroda, “Design and Analysis for ThruChip Design for Manufacturing (DFM),” 20th Asia and South Pacific Design Automation Conference , Proceedings, pp. 46-47, Jan. 2015.
A. Okada, A. Raziz Junaidi, Y. Take, A. Kosuge, and T. Kuroda, “Circuit and Package Design for 44GB/s Inductive-Coupling DRAM/SoC Interface,” 20th Asia and South Pacific Design Automation Conference, Proceedings, pp. 44-45, Jan. 2015.