W. Mizuhara, T. Shidei, A. Kosuge, T. Takeya, N. Miura, M. Taguchi, H. Ishikuro, and T. Kuroda, “A 0.15mm-Thick Non-Contact Connector for MIPI Using Vertical Directional Coupler,” IEEE International Solid-State Circuits Conference (ISSCC’13), Dig. Tech. Papers, pp. 200-201, Feb. 2013.
A. Kosuge, W. Mizuhara, N. Miura, M. Taguchi, H. Ishikuro, and T. Kuroda,
“A 12.5Gb/s/Link Non-Contact Multi-Drop Bus System with Impedance-Matched Transmission Line Couplers and Dicode Partial-Response Channel Transceivers,” 18th Asia and South Pacific Design Automation Conference (ASP-DAC’13), pp. 91-92, Jan. 2013.