RESEARCH
PAPER SUMMARY
Massive Orthogonal Stacking Assembly of IC (MOSAIC) Cube With Inductive Coupling for Exascale Memory Applications
MOSAIC with orthogonal stacking and inductive coupling is proposed and demonstrated for the first time.
This enables ultra high-density integration, high thermal performance, and simple assembly.
A 183.4nJ/inference 152.8uW Single-Chip Fully Synthesizable Wired-Logic DNN Processor for Always-On 35 Voice Commands Recognition Application
A wired-logic AI processor has been developed that can reduce the power consumption of voice command recognition AI by three orders of magnitude. In order to reduce the huge area, we have developed a new algorithm and circuit co-optimization method.
We succeeded in implementing all neurons and synapses of 16-layer deep neural network into a single chip.
