M2 Mitarai presented his work at SSDM 2025

On September 19th, M2 Mitarai gave an oral presentation on his work, titled "A 78% Area-Reduction in Edge-Coupled Inductive Coupling Link for Flexible Chip Assembly Using Oblong Coil," at International Conference on Solid State Devices and Materials (SSDM) 2025 held in Pacifico Yokohama.