Beyond IC Advanced 3D Chip Integration and Low-power Circuit Design Technology for Next-generation AI Computing Systems
Kosuge Laboratory, Graduate School of Engineering The University of Tokyo
TOPICS
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2025.12.27New paper about 3D chip stacking and thermal analysis is accepted to IEEE Transactions on Components, Packaging and Manufacturing Technology (TCPMT). You can see early access from here.
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2025.12.22The website about prospective students is now open. You can access from Here!
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2025.11.26We visited Yonsei University on October 31st to co-host the TY Workshop, and visited KAIST on November 4th to hold the KTT Workshop. Click here for details
RESEARCH
THEME
AI technology is transforming and enriching our lives, but also consumes huge amount of power to process large amounts of data. To solve the power problem caused by AI, we need next-generation integrated circuits (Beyond IC) specialized for the AI era, with performance beyond what an extension of conventional ICs can offer. We are researching wired-logic processors and 3D integration technologies specialized for AI processing which will achieve power reductions of three orders of magnitude or more.
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AI processor
With the new architecture and in/near memory computing techniques, we will achieve a 1,000 times improvement in power efficiency over conventional methods.
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3D Chip Integration
We will develop a new chip stacking method for high-dense computing. Highly reliable and dense interconnection realize scalable and high throughput computing system.
