Beyond IC Advanced 3D Chip Integration and Low-power Circuit Design Technology for Next-generation AI Computing Systems
Kosuge Laboratory, Graduate School of Engineering The University of Tokyo
TOPICS
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2026.2.25A paper about low-cost AI processor fabrication method is published in IEEE OJCAS. Please check here.
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2026.2.24The website about prospective students is now open. You can access from Here!
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2026.2.16M2 Mitarai presented his work titled “Analysis and Design of Oblong Coils and Standard-Cell-Based Receiver for Area-Efficient Edge-Coupled Inductive Coupling Transceiver,” at ASP-DAC 2026. Please check here.
RESEARCH
THEME
AI technology is transforming and enriching our lives, but also consumes huge amount of power to process large amounts of data. To solve the power problem caused by AI, we need next-generation integrated circuits (Beyond IC) specialized for the AI era, with performance beyond what an extension of conventional ICs can offer. We are researching wired-logic processors and 3D integration technologies specialized for AI processing which will achieve power reductions of three orders of magnitude or more.
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AI processor
With the new architecture and in/near memory computing techniques, we will achieve a 1,000 times improvement in power efficiency over conventional methods.
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3D Chip Integration
We will develop a new chip stacking method for high-dense computing. Highly reliable and dense interconnection realize scalable and high throughput computing system.
